Features
AI-assisted qualitative inspection conforming to international standards
Since values conforming to the standards are directly applied as inspection criteria, there is no dependency on the skill and expertise of the programmer.
AI technology to minimize programming and visual inspection efforts
1. AI self-optimization
2. Automatically acquire defect images for analysis and visualization of result data separation for AI-assisted defect determination
3. Visualization of the AI-determined settings
High-precision solder shape reconstruction
Equipped with our unique MDMC (Multi Direction/Multi Color) illumination and new MPS (Micro Phase Patented Shift) moiré technique. This enables higher robust and reliable inspection performance.
M2M*1 system focusing on quality
1. Preventing defects by:
- monitoring and reporting fluctuations in the measured values during production
- visualizing defect trends associated with chip mounter hardware such as heads and nozzles
2. Visualizing the quality by:
- process comparison
- displaying production status
- linking SPI/AOI/AXI systems
3. Improving the first pass yield rate of the line by automatically calculating post-print/post-placement inspection criteria based on the inspection results after the solder reflow process
*1. Abbreviation of machine-to-machine. It is a mechanism to optimize the quality and equipment operation status without human intervention, made possible by enabling autonomous communication and exchange of information between various connected, production equipment.
