These materials are crucial in applications where fragile electronics need to be protected from environmental and chemical corrosion and vibration.
Circalok 6055 encapsulant is a two-component epoxy encapsulating system designed for encapsulating and casting applications where non-burning properties are required.
Circalok 6250 hardener is a curing agent designed for use with various Circalok epoxy resins to obtain high solids formulations useful in adhesive, electrical encapsulation and laminate applications.
Circalok 6403 A BLK/B urethane encapsulant is a general purpose, two-component urethane designed for applications requiring a fast cure, mechanical shock-resistant system. Circalok 6403 A BLK/B urethane encapsulant does not contain MOCA or TDI.
Circalok 6403 A SLW/B urethane encapsulant is a general purpose, two-component urethane designed for applications requiring a fast cure, mechanical shock-resistant system. Circalok 6403 A SLW/B urethane encapsulant does not contain MOCA or TDI.
Circalok 6408 A SLW/B urethane encapsulant is a solvent-free, two-component system designed to provide a shock-resistant sealant for encapsulating and potting applications.
Circalok 6410 A/B urethane encapsulant is a two-component system formulated for tooling mechanical goods and model making. Circalok 6410 encapsulant is an easy handling casting elastomer designed for room temperature mixing, pouring and curing.
Circalok 6716/6733 silicone system is a two-component, solvent-free RTV silicone system ideal for potting and encapsulating both low- and highvoltage electrical and electronic assemblies.
Circalok 6735 encapsulant is a two-component, addition-cure silicone system for applications where high temperature service and flexible system are required. It adheres to most substrates without the use of a primer.
Circalok 6744 encapsulant is a two-component silicone system for use in applications requiring a low viscosity, flame retardant encapsulating material.
Circalok 9154 FR urethane encapsulant is a solvent-free, unfilled, two-component system designed for encapsulating and casting applications such as electrical cable encapsulation, general marine sealing and caulking, and waterproof fabric coatings.
LORD® 600/18 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 600/25 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 600/37 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 600/65 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 600/66 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 600/67 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 600/70 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 600/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
LORD® 975-1052 encapsulant is a two-component epoxy system designed specifically for encapsulating electronic components used in remote sensors and sensing devices. It provides a semi-rigid epoxy system for applications where thermal shock is expected.
Thermoset 300/18 epoxy system is a two-component, general purpose filled epoxy system which offers superior thermal conductivity, improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/65 epoxy system is a two-component, general purpose filled epoxy system which offers superior thermal conductivity, improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/67 epoxy system is a two-component, general purpose filled epoxy system which offers superior thermal conductivity, improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/70 epoxy system is a two-component, general purpose filled epoxy system which offers superior thermal conductivity, improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 300/72 epoxy system is a two-component, general purpose filled epoxy system which offers superior thermal conductivity, improved shock resistance and lower coefficient of thermal expansion compared to unfilled epoxy systems.
Thermoset 311 epoxy encapsulant is a two-component, filled epoxy system designed for electrical & electronic applications requiring high operating temperatures and applications where high thermal shock is expected. It provides a semi-rigid epoxy system.
Thermoset DC-812 epoxy encapsulant is a two-component system designed specifically for potting high voltage, automotive ignition coils.
Thermoset EP-20/18 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset EP-20/25 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset EP-20/37 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset EP-20/65 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset EP-20/66 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset EP-20/67 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset EP-20/70 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset EP-20/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset EP-729 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.
Thermoset EP-937 encapsulant is a black, one-component epoxy specifically designed to meet the needs of coating semiconductor devices on printed circuit boards.
Thermoset EP-954 epoxy encapsulant is a two-component, filled epoxy system designed for electrical & electronic applications requiring high operating temperatures. It provides semi-rigid epoxy system for applications where high thermal shock is expected.
Thermoset ES-100 encapsulant is a two-component epoxy system designed specifically for encapsulation of intricate electrical and electronic components used in automotive, marine and heavy industrial applications.
Thermoset ES-111 epoxy encapsulant is a two-component system designed specifically for high voltage, automotive ignition coils, where excellent adhesion to segmented bobbins is critical.
Thermoset ES-115 epoxy encapsulant is a two-component system designed specifically for use in high voltage, automotive ignition coils.
Thermoset ES-121LV epoxy encapsulant is a black, two-component system designed specifically for high voltage, automotive ignition coils, where excellent adhesion to segmented bobbins is critical.
Thermoset ES-40/18 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset ES-40/25 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset ES-40/37 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset ES-40/65 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset ES-40/66 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset ES-40/67 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset ES-40/70 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset ES-40/71 epoxy system is a two-component, general purpose system for use in many applications including adhesive, laminating and electrical/electronic insulation.
Thermoset Hardener No. 18 is a general purpose curing agent designed for use with select LORD, CoolTherm and Thermoset epoxy resins to obtain a variety of handling and cured properties.
Thermoset Hardener No. 25 is a curing agent designed for use with select LORD and Thermoset epoxy resins to obtain a variety of handling and cured properties. Compositions using this hardener are moisture insensitive and cure to a high gloss.
Thermoset Hardener No. 37 is a curing agent designed for use with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Provides improved flexibility and impact strength for use in room temp curing adhesive application.
Thermoset Hardener No. 65 is a curing agent designed for use with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Suitable for all types of room temp curing applications including adhesives & 100% solids coatings.
Thermoset Hardener No. 66 is a general purpose curing agent designed for use with select LORD & Thermoset epoxy resins to obtain variety of handling and cured properties. Suitable for variety of applications including structural adhesives and laminates.
Thermoset Hardener No. 67 is a curing agent designed for use with select LORD, CoolTherm and Thermoset epoxy resins to obtain a variety of handling and curing properties. Suitable for many types of encapsulation and potting applications.
Thermoset Hardener No. 70 is a curing agent designed for use with select LORD, CoolTherm & Thermoset epoxy resins to obtain variety of handling & curing properties. Compositions using this hardener have comparatively low viscosity & low surface tension.
Thermoset Hardener No. 71 is a curing agent designed for use with select LORD & Thermoset epoxy resins to provide semi-rigid epoxy system for use in applications where thermal shock is expected. Suitable for applications requiring thick section casting.
Thermoset No. 72 Hardener is used with Thermoset 300 resin to provide a semi-rigid epoxy system which cures at room temperature. It exhibits low exothermic heat rise during room temperature cure, and has excellent thermal and mechanical shock resistance.
Thermoset LS 213-9 encapsulant is a one-component epoxy impregnating compound for use in electrical lamination and potting applications. It can also be used as a reworkable underfill encapsulant.
Thermoset ME-430 encapsulant is a one-component, semiconductor grade epoxy for encapsulation of COB devices. Offers good adhesion to laminate & ceramic substrates. Can be used in high-end, consumer printed circuit board and semiconductor applications.
Thermoset ME-455 encapsulant is a one-component, semiconductor grade epoxy for encapsulation of wire-bonded or flip chip die in PPGA, BGA, MCM and other cavity packages. Offers good adhesion to silicon, laminate, ceramic, solder mask and metal surfaces.
Thermoset ME-456 encapsulant is a one-component, semiconductor grade epoxy dam material for use in the encapsulation of wire-bonded or flip chip devices where a dam is needed to restrict flow of a cavity fill encapsulant.
Thermoset ME-588 BK encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for the encapsulation of densely populated area array flip chip devices. It is engineered to withstand 260°C peak reflow temperatures of lead-free solders.
Thermoset ME-588 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for the encapsulation of densely populated area array flip chip devices. It is engineered to withstand 260°C peak reflow temperatures of lead-free solders.
Thermoset SC-300M silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. It cures to an extremely soft, gel-like consistency using either room temperature or heat cure.
Thermoset SC-316 silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. It cures to an extremely soft, gel-like consistency using room temperature cure.
Thermoset SC-319 is a two-component, room temperature curing silicone encapsulant.
Thermoset SC-400 silicone encapsulant is a two-component system designed for encapsulation of delicate electronic components. It cures to an extremely soft, gel consistency using either room temp or heat cure. It contains a UV dye to aid inspection.
Thermoset UR-105 urethane encapsulant is a two-component system designed for encapsulation of fragile, pressure sensitive microelectronic components. It cures to a soft, flexible gel using either room temperature or heat cure.
Thermoset UR-312 urethane encapsulant is a two-component, low modulus system designed for encapsulation of fragile, pressure-sensitive microelectronic components. It is formulated for use at different mix ratios to obtain different cured properties.
Thermoset UR-325 encapsulant is a two-component urethane system designed for encapsulating delicate, pressure or shock sensitive electronic components. It cures to a low modulus material using room temperature cure.
