Electrically conductive adhesives from Parker Chomerics are primarily used for electronics applications where components need to be held in place and an electrical current can be passed between them. Our electrically conductive adhesives come in a variety of different filler and binder options, and offer excellent electrical conductivity levels, strong adhesion properties, and have no volatile organic compounds or corrosive by-products. This makes them ideal for use for a variety of applications across many markets.
Parker Chomerics PRO-SHIELD 7058 electrically conductive epoxy combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver. Click into part number to purchase online now.
Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two-component, silver-filled epoxy formulated for thin bond lines and where precise application is required
Parker Chomerics CHO-BOND® 584-208 conductive adhesive is a two-component epoxy formulated with an extended working life ideal for high volume applications where a strong electrical bond is required
Parker Chomerics CHO-BOND® 580-208 conductive adhesive is a two-component, silver-filled epoxy is designed to be thinned and applied as an ink or spray coating
Parker Chomerics TECKNIT 8116 conductive adhesive is a two-component, silver-filled epoxy formulated to provide a strong bond and electrical pathway between mating surfaces
Parker Chomerics CHO-BOND® 360-20 conductive adhesive is a two-component, silver-plated copper filled epoxy formulated for exceptionally strong electrical bonds
Parker Chomerics CHO-BOND® 1030 conductive adhesive is a one component silver-plated copper filled silicone ideal for thin bond lines and bonding silicone EMI gaskets to metal substrates
Parker Chomerics CHO-BOND® 592 conductive adhesive is a two-component, silver-filled epoxy with good electrical conductivity and excellent adhesion characteristics
Parker Chomerics CHO-BOND® 1085 is an air-drying liquid coating used to improve the adhesion of Parker Chomerics CHO-BOND 1029 adhesive to metal and other non-silicone substrates.