Electrically Conductive Form-In-Place Material Gaskets

Parker Chomerics robotically dispensed Form-In-Place (FIP) EMI shielding gaskets provide the lowest total cost of ownership for small cross section and complex pattern applications. Parker Chomerics CHOFORM (conductive) and ParPHorm (non-conductive) FIP materials can reduce installed cost of an EMI gasket by up to 60%.

CHOFORM 5575 Ag/Al Moisture Cure One Component Form-In-Place Silicone EMI Gasketing

Parker Chomerics CHOFORM 5575 form-in-place EMI gasket is a moisture cure silicone system with 80 dB shielding effectiveness ideal for corrosion resistance in high temperature applications.

CHOFORM 5528 Ag/Cu Moisture Cure One Component Form-In-Place Silicone EMI Gasketing

Parker Chomerics CHOFORM® 5528 form-in-place EMI gasket is a moisture cure silicone system with >70 dB shielding effectiveness while providing a soft, low closure force gasket.

CHOFORM 5513 Ag/Cu Thermal Cure Two Component Form-In-Place Silicone EMI Gasketing

Parker Chomerics CHOFORM® 5513 form-in-place EMI gasket is a thermal cure silicone system providing >70 dB shielding effectiveness and excellent adhesion to chromate coated aluminum surfaces.

CHOFORM 5560 Ni/Al Thermal Cure One Component Form-In-Place Silicone EMI Gasketing

Parker Chomerics CHOFORM® 5560 form-in-place EMI gasket is a low hardness, thermal cure silicone system with >90 dB shielding effectiveness and excellent galvanic corrosion resistance.

CHOFORM 5550 Ni/C Thermal Cure One Component Form-In-Place Silicone EMI Gasketing

Parker Chomerics CHOFORM® 5550 form-in-place EMI gasket is a low hardness, thermal cure silicone system with >65 dB shielding effectiveness and good galvanic corrosion resistance.

CHOFORM 5538 Ni/C Moisture Cure One Component Form-In-Place Silicone EMI Gasketing

Parker Chomerics CHOFORM® 5538 form-in-place EMI gasket is a moisture cure silicone system used in small bead size applications while providing >65 dB shielding effectiveness and good galvanic corrosion resistance.

CHOFORM 5526 Ag Moisture Cure One Component Form-In-Place Silicone EMI Gasketing

Parker Chomerics CHOFORM® 5526 form-in-place EMI gasket is a one-component, moisture cure silicone system with >100 dB shielding effectiveness while providing a soft, low closure force gasket.

CHOFORM 5541 Ni/C Thermal Cure One Component Form-In-Place Silicone EMI Gasketing

Parker Chomerics CHOFORM® 5541 form-in-place EMI gasket is a thermal cure silicone system with >65 dB shielding effectiveness, good galvanic corrosion resistance and superb adhesion properties.

ParPHorm 1800 Form-In-Place Sealing Compound

Parker Chomerics PARPHORM® 1800 non-conductive, moisture cure silicone elastomer is designed for enclosures that require low closure force, excellent adhesion, and very good compression set qualities.

ParPHorm L1938 Form-In-Place Sealing Compound

Parker Chomerics PARPHORM® L1938 non-conductive, fluorosilicone material is a thermal cure system specially designed for fluid resistance applications.