Parker Chomerics THERMFLOW® phase-change Thermal Interface Materials (TIMs) completely fill interfacial air gaps and voids. They also displace entrapped air between power dissipating electronic components. Phase-change materials are designed to maximize heat sink performance and improve component reliability.
THERMFLOW Phase-Change Thermal Interface Pads
Parker Chomerics THERMFLOW phase-change thermal Interface Materials (TIMs) are solid at room temperature and become liquid at the phase-change temperature, completely filling interfacial air gaps and voids.
