Parker thermal interface materials transfer heat from electronic components to heat sinks and are used to eliminate air gaps from the interface. Our Chomerics THERM-A-GAP® and Lord CoolTherm® materials deliver lower thermal impedance, higher thermal conductivity and greater compliance and conformability to both microelectronics and large scale electronics. They are also highly reliable and will enhance your application’s handling ease and performance, guaranteeing a longer service life. Our thermal interface materials have been designed into thousands of applications, ensuring high performance and integrity.
