CoolTherm® SC-6715/6730 silicone system is a two-component, solvent-free RTV silicone system ideal for
potting and encapsulating densely packed components and for producing flexible molds.
CoolTherm® SC-6715/6731 silicone system is a two-component, solvent-free RTV silicone system ideal for
potting and encapsulating densely packed components and for producing flexible molds.
CoolTherm® SC-6717/6731 system is a two-component, solvent-free RTV silicone system is ideal for potting, encapsulating and coating applications.
CoolTherm® SC-6725 encapsulant is a two-component, thermally conductive, addition-cure silicone system used in applications where high temp service is required. It cures to a red elastomer which adheres to most substrates without the use of a primer.
CoolTherm® SC-6726 encapsulant is a two-component, addition-cure silicone system for use in applications where high temperature service is required. It adheres to most substrates without the use of a primer.
CoolTherm® UR-288 encapsulant is a two-component urethane system designed for encapsulating and casting applications. It cures at room temperature to produce a flame retardant, semi-flexible material.
CoolTherm® UR-388 FST (fast) encapsulant is a two-component urethane system designed for encapsulating and casting applications. It cures at room temperature to produce a flame retardant, semi-flexible material.
CoolTherm® UR-388 encapsulant is a two-component urethane system designed for encapsulating and casting applications. It cures at room temperature to produce a flame retardant, semi-flexible material.
CoolTherm® UR-389 encapsulant is a two-component urethane system designed for encapsulating and casting applications. It cures at room temperature to produce a flame retardant, semi-flexible material.
Parker Chomerics THERM-A-FORM™ T642 is a two-component, silicone elastomer with 1.20 W/m-k thermal conductivity and ideal for underfilling applications.
Parker Chomerics THERM-A-FORM™ 1641 is a one-component, RTV silicone elastomer with high operating temperature range and 0.9 W/m-k thermal conductivity.
Parker Chomerics THERM-A-FORM™ 1642 is a two-component, general duty, economical thermally conductive encapsulant/sealant/caulk with high shelf life (12 months) and low viscosity
Parker Chomerics THERM-A-FORM™ T647 is a two-component. Low modulus, high thermal conductivity (3.0 W/m-k) silicone elastomer ideal for filling complex geometries and maintaining contact with electrical components.
Parker Chomerics THERM-A-FORM™ T646 is a two-component, high pot life (5 hours), economical silicone elastomer with 0.9 W/m-k thermal conductivity
Parker Chomerics CHO-BOND® 1087 primer is a low viscosity, blue liquid formulated to provide adhesion between our CHO-THERM® 1642 two component silicone based compound and non-silicone substrates such as metals, glass, plastic and ceramics.
CoolTherm® EP-2000 encapsulant is a two-component, low viscosity epoxy system designed for encapsulation of devices with small-diameter, tightly-packed windings. It provides high-temperature stability combined with excellent electrical insulation.
CoolTherm® EP-301 AD resin is a general purpose epoxy resin designed for use with CoolTherm EP-6010 hardener to create a two-component system for applications requiring excellent heat transfer, high fluidity and good air release.
CoolTherm® EP-340/18 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.
CoolTherm® EP-340/67 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.
CoolTherm® EP-340/70 epoxy system is a two-component system designed to provide maximum thermal conductivity and outstanding mechanical properties. Offers a very low coefficient of thermal expansion.
CoolTherm® EP-3500 epoxy system is a two-component system for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.
CoolTherm® EP-3500/EP-2000 two-component epoxy system is for encapsulation of devices requiring a rigid, high thermal conductivity material with a low coefficient of thermal expansion. Provides high-temp stability with excellent electrical insulation.
CoolTherm® EP-6008 BLK/6010 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
CoolTherm® EP-6008 BLK/6252 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
CoolTherm® EP-6008 BLK/Thermoset No.67 epoxy system is a general purpose potting and encapsulation compound. This two-component compound flows easily around intricate and densely packaged circuity.
CoolTherm® EP-6009 encapsulant is a two-component epoxy system designed to provide thermal conductivity for potting applications requiring flame retardance.
CoolTherm® EP-6010 hardener is an epoxy curing agent designed for use with various CoolTherm and LORD epoxy resins to create two-component systems used in electrical encapsulation and bonding applications.
CoolTherm® EP-6028/6029 encapsulant is a two-component epoxy system used for potting high voltage transformers, specifically units designed for high temp service. It provides a rigid epoxy system for use in applications where thermal shock is expected.
CoolTherm® EP-6035 encapsulant is recommended as a thermally conductive, thin bondline adhesive for attaching semiconductors to heat sinks, and as a low viscosity potting product for use where thermal conductivity & non-burning properties are required.
CoolTherm® EP-6252 hardener is an epoxy curing agent designed for use with various CoolTherm and LORD® epoxy resins to create two-component systems used in electrical encapsulation and bonding applications.
CoolTherm® EP-636 epoxy encapsulant is a two-component system specifically designed for high temperature applications. It is recommended for encapsulation of electric motor stator assemblies used on downhole oil pumps.
CoolTherm® ME-525 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.
CoolTherm® ME-531 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.
CoolTherm® ME-543 encapsulant is an anhydride-free, semiconductor grade epoxy underfill product for encapsulation of densely populated area array flip chip devices. Is formulated with the necessary structural strength to handle over-molding processes.
CoolTherm® ME-555 encapsulant is a high purity, semiconductor grade epoxy underfill product for the encapsulation of flip chip devices. It is formulated to reduce warpage and engineered to withstand 260°C peak reflow temperatures of lead-free solders.
CoolTherm® SC-104 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-252 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-303 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/ electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-305 silicone encapsulant is a two-component system used for a variety of electronics applications where high heat dissipation is required.
CoolTherm® SC-309 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-320 SLW silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-320 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-324 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-324 XLW silicone encapsulant is a two-component system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-420 silicone encapsulant is a two-component system designed to provide excellent thermal conductivity and flexibility for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-6702 thermally conductive silicone encapsulant is a two-component system designed to provide thermal conductivity for encapsulating sensitive electronic modules.
CoolTherm® SC-6705 FST (fast) encapsulant is a two-component, addition-cure silicone system for use in applications where high temperature service and a flexible system are required.
CoolTherm® SC-6705 encapsulant is a two-component, addition-cure silicone system for use in applications where high temperature service and a flexible system are required.
CoolTherm® SC-6709/6730 silicone encapsulant is a two-component, solvent-free RTV silicone system. It is an ideal potting compound for any application where rapid heat transfer, high temperature service and a flexible system are required.
CoolTherm® SC-6710 RED/6730 silicone system is a two-component, RTV silicone system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-6710 RED/6731 silicone system is a two-component, RTV silicone system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-6710 RED/6732 silicone system is a two-component, RTV silicone system designed to provide excellent thermal conductivity for electrical/electronic encapsulating applications, while retaining desirable properties associated with silicones.
CoolTherm® SC-6711 WHT/6730 silicone encapsulant is a two-component, thermally conductive encapsulant system with outstanding electrical properties. Is ideal for applications where rapid heat transfer, high temp service & flexible system are required.
CoolTherm® SC-6711 WHT/6731 silicone encapsulant is a two-component, thermally conductive encapsulant system with outstanding electrical properties. Is ideal for applications where rapid heat transfer, high temp service & flexible system are required.
CoolTherm® SC-6711 WHT/6732 silicone encapsulant is a two-component, thermally conductive encapsulant system with outstanding electrical properties. Is ideal for applications where rapid heat transfer, high temp service & flexible system are required.
CoolTherm® SC-6712 WHT/6730 silicone system is a two-component, solvent-free RTV silicone system ideal for potting and encapsulating densely packed components and for producing flexible molds.
CoolTherm® SC-6712 WHT/6731 silicone system is a two-component, solvent-free RTV silicone system ideal for potting and encapsulating densely packed components and for producing flexible molds.
